At TeraView we consider TPI™ to
be the next significant unique imaging diagnostic modality,
which offers unique measurement and sampling advantages
over existing imaging technologies such as X-Ray, CT,
PET, Ultrasound and MRI.
TPI™ is an ideal solution
for providing 3D imaging of the inside of an integrated
circuit device. TPI™ yields
significant advantages over existing techniques such
as X-ray analysis, which provides only 2D images and
can damage the semiconductor in the device, and other
techniques such as ultrasound which provides limited
resolution and can be difficult to implement.
Top surface
External pins = 1mm depth
Transistor = 3mm depth
Pads on bottom surface =
4mm
3D TPI™ images
of different layers at different depths within
an integrated circuit device.
Our material characterization
capabilites open up new avenues for research and non-destructive
testing of many substances from semiconductors to food
and paint coatings.
