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Fault Analysis in Advanced Semiconductor Packages using Terahertz
Time Domain Reflectometry

fault analysisTeraView, working with Intel Corporation, has developed a next generation Terahertz (THz) Time Domain Reflectometry (TDR) Failure Analysis tool to enable high resolution fault isolation in advanced and 3D semiconductor packages. Called EOTPR 3000 (Electro Optical Terahertz Pulsed Reflectometry), the tool can isolate faults within 10µ and has reduced fault isolation times from days to hours.


Fault isolation is a key step of the failure analysis (FA) process determining the effectiveness of the physical failure analysis (PFA) by identifying and localising suspected failures. And with the rising design complexity of semiconductor Integrated Circuit (IC) devices it has become increasingly important to ensure high-precision fault isolation. EOTPR 3000 uses THz TDR that allows for non-destructive, high-accuracy fault isolation of shorts, dead opens, and resistive opens localising the defects in complex package designs.

Intel said of the technology: “With such a revolutionary concept, innovative design and superior performance, EOTPR will become an essential tool for microelectronic package fault isolation and failure analysis. By integrating EOTPR with other techniques such as 3D X-Ray in the FA flow, FA TPT and success rate can be dramatically improved. Fully automated systems can be developed for component, board and solder joint quality screening.”

terahertz time-domain reflectrometry

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