Fault Analysis in Advanced Semiconductor Packages using Terahertz Time Domain Reflectometry

TeraView, working with the Intel Corporation, has developed a next generation Terahertz (THz) Time Domain Reflectometry (TDR) Failure Analysis tool to enable high resolution fault isolation in advanced and 3D semiconductor packages. Called EOTPR2000, the tool can isolate faults within 10µ’s and has reduced fault isolation times from days to hours

Intel said of the technology “With such a revolutionary concept, innovative design and superior performance, EOTPR will become an essential tool for microelectronic package fault isolation and failure analysis. By integrating EOTPR with other techniques such as 3D X-Ray in the FA flow, FA TPT and success rate can be dramatically improved. Fully automated systems can be developed for component, board and solder joint quality screening.”

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