EOTPR2000 - Electro optical terahertz pulsed reflectometry

The unit is used to identify and quickly isolate faults on the interconnects of advanced packages, such as Flip Chip, Package on Package (PoP) and potentially Through-silicon vias(TSV)

Key advantages of the EOTPR2000 system include

• Rapid fault isolation—minutes rather than days
• Identification of weak connections that may lead to  future faults
• Ability to isolate faults not previously seen with conventional TDR units
• 10 micron resolution