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Until
now, the non-destructive image analysis of many
materials at depths greater
than ~200µm
with optical technologies was not achievable.
TeraView’s TPI™ imaga
family of THz imaging systems combine powerful,
ultra-fast Ti-Sapphire
laser sources and semiconductor based detection systems
with time-domain measurements to probe at depths
of 3 mm or greater, depending upon the matrix properties.
For many materials, chemical and 3D mapping results
are obtained in 20 minutes or less.
- Non-destructive imaging of fibrous, powdered
or densely packed materials, laminates, paints
and
coatings,
semiconductors, ceramics, explosives and tissue
- Non-destructive, 3D volumetric imaging of tablet
coatings and cores
- Solid-state emitter and detector for ambient
temperature operation
- Bespoke optics casing with controlled alignment
optics for system optimization
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